MediaTek has just announced their newest flagship chipset that aims to target the high-end chips in the market and it’s the Dimensity 9000 5G chipset. This is the first chip to be built under the 4nm process by TSMC.
The SoC from MediaTek comes with a Cortex-X2 ultra core clocked at 3.05GHz along with 3x Cortex-A710 cores that are clocked at 2.85GHz and also a 4x efficient Cortex-A510 cores that are clocked at 1.8GHz. The Dimensity 9000 5G chip will support sub-GHz 5G, Bluetooth 5.3, & WiFi 6E 2×2 for connectivity and as for the RAM, it support LPDDR5x RAM that comes with up to 7500Mbps on smartphones.
The new chipset also comes with a 10x Mali-G710 GPU and an SDK for raytracing for better graphics in terms of gaming and for the ISP, it supports 4K HDR Video from three cameras simultaneously and it can support up to 320MP camera sensors. While the new APU supports 4x better performance than the previous generation.
The Dimensity 9000 5G chip is expected to arrive on smartphones next year.
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